I ka hana ʻana i nā hōʻike LED, ʻo ke koho ʻana o nā mea e pili pono i ka hana o ka huahana, ka lōʻihi, a me ka hōʻike hope. Mai ka pahu kukui -puke a hiki i ka mea hoʻopili, mai ka PCB substrate a i ka hale, pono nā hoʻoholo waiwai i kēlā me kēia pae i ka loiloi piha e pili ana i ke ʻano o ka noi, nā kūlana kaiapuni, a me nā koi kālā. Hoʻopili kēia ʻatikala i nā waiwai waiwai o nā ʻāpana koʻikoʻi e hāʻawi i ke alakaʻi ʻoihana no nā pono pilikino.
ʻO ke kumu o ke kukui kukui
ʻO nā lei kukui LED ke kumu kumu -mea hoʻopuka kukui o kahi hōʻike, a pili pono ko lākou mea i ka ʻōlinolino, hoʻopuka kala, a me ke ola. I kēia manawa, ho'ohana ka ho'onā ko'iko'i i ka gallium nitride (GaN)-iki i ho'opa'a 'ia me ka resin epoxy a i 'ole silicone. No nā noi -kiʻekiʻe (e like me nā pale hoʻolaha waho), ʻoi aku ka maikaʻi o nā pahu kukui keleawe-ma muli o ko lākou ʻoi aku o ka wela ma luna o nā pale hao, e hōʻemi ana i ka pohō māmā. Ma ka ʻaoʻao ʻē aʻe, hoʻohana ʻia ka EMC (epoxy molding compound) nā mea hōʻike pitch maikaʻi i loko, e hoʻohana ana i nā mea wela loa -no ka hoʻokō ʻana i ka mana pixel pitch paʻa. No nā pono kūikawā, e like me ka ultraviolet a i ʻole nā noi infrared, pono nā pahu kukui kūikawā me AlGaInP a i ʻole InGaN{10}}
ʻO ka pāpaʻi PCB: Ke kaulike ʻana i ka hana uila a me ka hemo ʻana o ka wela
Pono ke koho ʻana i nā mea no nā papa kaapuni paʻi (PCB) e kaulike i ka conductivity uila a me ka conductivity thermal. Hoʻohana pinepine nā huahana maʻamau i nā papa fiberglass FR-4 (ka helu pale ahi UL94-V0), kūpono no nā kaiapuni o loko. Eia naʻe, no nā hōʻike mana kiʻekiʻe-a kiʻekiʻe paha-(e like me nā pale hoʻolimalima a me nā pale kahua pāʻani), nā PCB ma muli o ke alumini (MCPCB) a i ʻole nā PCB ma muli o ke keleawe{13}}e hāʻawi i nā pono. Hoʻopau koke kā lākou mau mea metala i ka wela, e pale ana i ka overheating kūloko a me ka hemahema o ka pixel. Hoʻohana nā papahana kiʻekiʻe i nā substrate seramika (e like me ke alumini nitride, AlN). ʻOiai ʻoi aku ka nui o ke kumukūʻai, hiki i kēia mau substrates ke hiki i nā hoʻonohonoho kaapuni ultra-precise a hiki i ka pae millimeter.
ʻO ka pā a me ke kūkulu pale: ʻo ka hōʻoia kumu o ka hiki ke hoʻololi i ke kaiapuni
Pono e loaʻa i nā pale ma waho i ka helu palekana i hoʻoikaika ʻia (IP65 a i ʻole). Hana ʻia nā pā mai ka make-aluminika hoʻoheheʻe ʻia a i ʻole nā mea hoʻohuihui kalapona. Hoʻohana ka mea mua i kahi kaʻina hana hoʻoheheʻe i hoʻohui ʻia e hōʻoia i ka ikaika o ke kūkulu ʻana aʻo ka hāʻawi pū ʻana i ka wela wela. He māmā ka hope a kūpono no nā noi hoʻolimalima e koi ana i ka hui pinepine a me ka wehe ʻana. E pili ana i ka mālama ʻana i ka ʻili, he mea nui nā pale pale UV-a me ka pale ʻana i ka ʻinoʻino. ʻOi aku ma nā wahi kahakai a i ʻole ka ua, ua ʻōlelo ʻia he ʻoluʻolu pale -pālua ʻelua o ke kila hao a me ka uhi ʻana-nono.
Nā IC Keaukaha a me nā Uila: ʻO ke kī huna i ka lawe ʻana i ka hōʻailona
Hoʻopili ka mea paʻi o ka mea hoʻokele kaʻa puni (IC) i ka wikiwiki o ka pane a me ka paʻa. No ka laʻana, hoʻopaʻa pololei nā pūʻolo hoʻohui COB (Chip on Board) i ka chip me ka resin epoxy, e hōʻemi ana i ka nui o ka hāʻule ʻana o ka hui solder; hilinaʻi nā pūʻolo SMD kuʻuna i ka mana arc o nā substrate -kiʻekiʻe FR-4. Pono nā uwea mana a me nā hōʻailona e hoʻohana i ka oxygen-kopa keleawe manuahi me ka papalua-papa pale. No nā papahana o waho, ʻōlelo ʻia ka PVC kūpaʻa i ka wā a i ʻole silicone rubber out sheathing e pale aku i ka hiki ʻole o ka insulation ma muli o ka ʻelemakule UV.
Ka Hopena: Pono e hoʻokō i nā Koina Kūlana
Material selection isn't a matter of single parameters; it's a systematic process based on factors such as brightness requirements (e.g., >8000 nits ma waho vs.<1000 nits indoors), environmental harshness (temperature, humidity, dust, vibration), and maintenance cycles. We recommend that users communicate in depth with manufacturers during the initial stages of customization, using methods such as finite element analysis (FEA) to simulate thermal distribution and salt spray testing to verify corrosion resistance, to ensure that the final solution achieves optimal performance while maintaining controllable costs.
